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GUC GLink™ Chip Leverages proteanTecs’ Die-to-Die Interconnect Monitoring

Outcomes spotlight how deep information efficiency and reliability monitoring delivers complete visibility into excessive bandwidth interfaces

HAIFA, Israel, Oct. 25, 2022 – proteanTecs, a world chief of deep information analytics for superior electronics, introduced the outcomes of its collaboration with superior ASIC supplier, World Unichip Company (GUC), are shared in a brand new white paper.

The GUC and proteanTecs collaboration began with the reliability monitoring of excessive bandwidth reminiscence (HBM) interfaces and has continued with GUC’s second technology of its GLink™ interface, referred to as GLink 2.0. GLink is a excessive bandwidth die-to-die (D2D) parallel interface that options industry-leading efficiency, together with low latency and energy effectivity. proteanTecs’ interconnect monitoring resolution was built-in into the GLink take a look at chip to supply GUC enhanced visibility in testing and characterizing the PHY and to boost the tip product with in-field efficiency and reliability monitoring.

“proteanTecs is the one firm at this time providing complete visibility into excessive bandwidth D2D interfaces,” stated Igor Elkanovich, CTO at GUC. “Their high-resolution interconnect monitoring options ship parametric lane grading with 100-percent lane and pin protection, empowering us with important insights that each speed up and improve our system testing and characterization, and supply our clients in-mission lifetime monitoring.”

“GUC’s 2.5D/ 3D superior packaging applied sciences are enjoying an necessary function in addressing the semiconductor {industry}’s ‘Greater than Moore’ evolution to chiplets and heterogeneous integration,” stated Evelyn Landman, co-founder and CTO at proteanTecs. “We look ahead to our continued collaboration on GUC’s household of D2D interface options as we assist the increasing superior packaging ecosystem.”

Silicon outcomes and key findings at the moment are obtainable in a brand new white paper and will likely be shared in technical shows and a webinar.

  • The white paper, “GUC GLink Take a look at Chip Makes use of In-Chip Monitoring and Deep Information Analytics for Excessive Bandwidth Die-to-Die Characterization,” is accessible right here.

  • The presentation titled “GUC’s GLink Case Examine: Efficiency and Reliability Monitoring for Heterogeneous Packaging, Combining Deep Information with Machine Studying Algorithms,” will likely be delivered at quite a few {industry} occasions, together with in North America on Oct. 26, Europe on Nov. 8, and China on Dec. 6.

  • proteanTecs will host a webinar on “The Period of Chiplets and Heterogeneous Integration: Challenges and Rising Options to Help 2.5D and 3D Superior Packaging” with audio system from GUC and Yole Développement. To attend this Nov. 16 webinar, register right here.

Each proteanTecs and GUC are contributing members of the UCIe™ (Common Chiplet Interconnect Categorical) Consortium, which is uniting {industry} leaders in constructing an interoperable, multi-vendor ecosystem and standardizing future generations of D2D interconnects and protocol connections.

This can be a joint PR printed by proteanTecc:

About GUC

GLOBAL UNICHIP CORP. (GUC) is the Superior ASIC Chief, who supplies the semiconductor {industry} with main IC implementation and SoC manufacturing providers, utilizing superior course of and packaging expertise. Primarily based in Hsin-chu Taiwan, GUC has developed a world popularity with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Inventory Trade underneath the image 3443. For extra data, go to

About proteanTecs

proteanTecs is a number one supplier of deep information monitoring options for superior electronics within the Datacenter, Automotive, Communications and Cellular markets. Primarily based on Common Chip Telemetry™ (UCT), the corporate supplies system well being and efficiency monitoring, from manufacturing to the sector. By making use of machine studying to novel information created by on-chip UCT brokers, the corporate’s analytics platform delivers predictive insights and visibility, resulting in new ranges of high quality, reliability and scale. Based in 2017, the corporate is headquartered in Israel with places of work within the U.S., India and Taiwan. For extra data, go to:

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