ARM Architecture

Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Suppliers Be a part of Forces to Standardize Chiplet Ecosystem


BEAVERTON, Ore.– March 02, 2022 — Superior Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Company, Meta, Microsoft Company, Qualcomm Integrated, Samsung, and Taiwan Semiconductor Manufacturing Firm at the moment introduced the formation of an {industry} consortium that can set up a die-to-die interconnect commonplace and foster an open chiplet ecosystem.

The group, representing a various ecosystem of market segments, will deal with buyer requests for extra customizable package-level integration, connecting best-in-class die-to-die interconnect and protocols from an interoperable, multi-vendor ecosystem.

Common Chiplet Interconnect Categorical (UCIe) Specification now out there

The founding corporations additionally ratified the UCIe specification, an open {industry} commonplace developed to determine a ubiquitous interconnect on the bundle degree. The UCIe 1.0 specification covers the die-to-die I/O bodily layer, die-to-die protocols, and software program stack which leverage the well-established PCI Categorical® (PCIe®) and Compute Categorical Hyperlink™ (CXL™) {industry} requirements. The specification can be out there to UCIe members and out there to obtain on the web site.

Open for membership

The founding corporations characterize a variety of {industry} experience and embrace main cloud service suppliers, foundries, system OEMs, silicon IP suppliers, and chip designers, and they’re within the technique of finalizing incorporation as an open requirements physique. Upon incorporation of the brand new UCIe {industry} group later this 12 months, member corporations will start work on the following era of UCIe know-how, together with defining the chiplet kind issue, administration, enhanced safety, and different important protocols. To be taught extra about membership alternatives, contact admin@UCIexpress.org.

Sources:

About Common Chiplet Interconnect Categorical (UCIe)

Common Chiplet Interconnect Categorical (UCIe) is an open specification that defines the interconnect between chiplets inside a bundle, enabling an open chiplet ecosystem and ubiquitous interconnect on the bundle degree. Superior Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Company, Meta, Microsoft Company, Qualcomm Integrated, Samsung, and Taiwan Semiconductor Manufacturing Firm are forming an open {industry} commonplace group to advertise and additional develop the know-how, and to determine a world ecosystem supporting chiplet design. For extra info, go to www.UCIexpress.org.

Common Chiplet Interconnect Categorical (UCIe) Promoter Statements of Assist (Alphabetized by Firm)

Superior Semiconductor Engineering, Inc. (ASE)

“The age of Chiplets has really arrived, driving the {industry} to evolve from silicon-centric considering to system degree planning and putting essential give attention to co-design of IC and bundle. We’re assured that UCIe will play a pivotal position in enabling ecosystem efficiencies, by reducing improvement time and price via open requirements for interfaces between varied IPs inside a multi-vendor ecosystem in addition to utilization of superior bundle degree interconnect. There’s broad {industry} recognition that Heterogeneous Integration will assist deliver Chiplet-based designs to market. Given ASE’s experience in packaging, meeting, and interconnect platform know-how, we are going to present UCIe with significant perspective to make sure forthcoming requirements are practicable, complemented by commercially viable efficiency and manufacturing prices for bundle degree manufacturing.”
Dr. Lihong Cao, Director of Engineering and Technical Advertising at ASE, Inc.

AMD

“AMD is proud to proceed our lengthy historical past of supporting {industry} requirements that may allow modern options addressing the evolving wants of our prospects. We now have been a pacesetter in chiplet know-how and welcome a multi-vendor chiplet ecosystem to allow customizable third-party integration. The UCIe commonplace can be a key issue to drive programs innovation leveraging heterogeneous compute engines and accelerators that can allow the most effective options optimized for efficiency, price, and energy effectivity.”
Mark Papermaster, Govt Vice President and Chief Know-how Officer, AMD

Arm

“Interoperability is crucial to eradicating fragmentation throughout the Arm ecosystem, and throughout the {industry}. By collaborating with different leaders in computing, Arm is dedicated to serving to develop requirements and specs like UCIe to allow the system designs of our future.”
Andy Rose, chief system architect and fellow, Arm

Google Cloud

“An open, requirements primarily based chiplet ecosystem is a vital enabler to foster Techniques on Chip (SoC) designs as the mixing level for an optimized system. Google Cloud is happy to contribute to the Common Chiplet Interconnect Categorical commonplace in service of the event of a multi-vendor inter-operable chiplet market for the good thing about the {industry}.”
Partha Ranganathan, Google Fellow and Vice President

Intel Company

“Integrating a number of chiplets in a bundle to ship product innovation throughout market segments is the way forward for the semiconductor {industry} and a pillar of Intel’s IDM 2.0 technique. Essential to this future is an open chiplet ecosystem with key {industry} companions working collectively below the UCIe Consortium towards a standard purpose of remodeling the way in which the {industry} delivers new merchandise and continues to ship on the promise of Moore’s Legislation.”
Sandra Rivera, Govt Vice President, Intel Company and GM, Information Heart & AI

Meta

“Meta is happy to hitch UCIe as a founding member to allow and foster a standards-based die-to-die interconnect. Meta initiated ecosystem improvement to advertise chiplet-based SOCs through the Open Compute Mission (OCP) and is happy to collaborate with different {industry} leaders through UCIe consortium for the continuing and future success on this space.”
Vijay Rao, Listing of Know-how and Technique, Meta

Microsoft Company

“Microsoft is becoming a member of the UCIe {industry} group to speed up the tempo of datacenter innovation and allow new breakthroughs in silicon design. We look ahead to combining efforts of the group with our personal achievements to drive step-function enhancements in silicon structure for the good thing about our prospects.”
Dr. Leendert van Doorn, Distinguished Engineer, Azure, Microsoft

Qualcomm Integrated

“Qualcomm is happy that the {industry} is coming collectively to kind UCIe, which ought to transfer chiplet know-how ahead—an vital know-how to deal with the challenges in our more and more advanced semiconductor programs.”
Dr. Edward Tiedemann, Senior Vice-President, Engineering, Qualcomm Applied sciences, Inc.

Samsung

“Samsung envisions chiplet know-how turning into vital for efficiency positive factors in computing programs as course of nodes proceed to scale, with dies inside every bundle ultimately speaking via a single language. We count on the UCIe Consortium to foster a vibrant chiplet ecosystem and set up the framework for a viable open-standard interface industry-wide. As a complete options supplier for reminiscence, logic, and foundry, Samsung anticipates spearheading consortium efforts to additional establish the most effective methods for enhancing system efficiency via chiplet know-how.”
Cheolmin Park, Vice President of Reminiscence Product Planning Workforce at Samsung Electronics

Taiwan Semiconductor Manufacturing Firm

“TSMC is happy to take part on this industry-wide consortium that can broaden the eco-system for package-level integration. TSMC gives varied silicon and packaging applied sciences that present a number of implementation choices for heterogeneous UCIe gadgets.”
Lee-Chung Lu, TSMC Fellow and Vice President of Design and Know-how Platform

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button