ARM Architecture

proteanTecs Joins UCIe™ (Common Chiplet Interconnect Specific™) Consortium to Advance 2.5D/3D Interconnect Monitoring


Brings experience in efficiency and reliability monitoring of die-to-die interfaces to the rising UCIe open chiplet ecosystem

HAIFA, Israel, Sept. 19, 2022 — proteanTecs, a world chief of deep knowledge analytics for superior electronics, has joined the UCIe™ (Common Chiplet Interconnect Specific™) Consortium to introduce interconnect well being monitoring to the increasing superior packaging ecosystem.

Launched in March 2022, UCIe™ goals to create a common interconnect on the bundle degree, addressing a surging “Extra Than Moore” market which is anticipated to develop at a CAGR of 19% till 2027.1 The consortium unites trade leaders in constructing an interoperable, multi-vendor ecosystem and standardizing future generations of die-to-die (D2D) interconnects and protocol connections. UCIe is led by key trade leaders Superior Semiconductor Engineering, Inc. (ASE), Alibaba Group, AMD, Arm, Google Cloud, Intel Company, Meta, Microsoft Company, NVIDIA, Qualcomm Included, Samsung Electronics, and Taiwan Semiconductor Manufacturing Firm.

“As we construct a vibrant chiplet ecosystem, guaranteeing compliance and interoperability throughout chiplets can be an vital space of focus for the UCIe Consortium,” says Dr. Debendra Das Sharma, Board Chair at UCIe Consortium. “We welcome the standard and reliability perspective that proteanTecs brings as a Contributor member and are trying ahead to their useful contribution to UCIe going ahead.”

“The UCIe Consortium is efficiently uniting the trade as we usher within the new period of semiconductor innovation and scaling by superior packaging,” says Evelyn Landman, co-founder and CTO at proteanTecs. “Collaborating within the UCIe will allow us to raised tailor our interconnect monitoring roadmap to those rising trade wants, whereas additionally sharing our wealthy expertise in offering visibility to the 1000’s of potential failure factors in a heterogenous system, in manufacturing and within the discipline.”

proteanTecs gives a high-resolution interconnect monitoring resolution that helps visibility at each stage—from characterization and qualification, meeting and check, to discipline deployment and operation. In contrast to conventional approaches—which depend on low-granularity, pass-fail testing—this market-leading, patented resolution delivers parametric lane grading with 100-percent lane and pin protection.

For extra data on proteanTecs’ interconnect monitoring options, obtain these sources:

1 Yole Développement, Excessive-Finish Efficiency Packaging 2022 – Focus 2.5D/ 3D Integration, March 2022.

About UCIe™ Consortium

The UCIe Consortium is an trade consortium devoted to advancing UCIe™ (Common Chiplet Interconnect Specific™) expertise, an open trade customary that defines the interconnect between chiplets inside a bundle, enabling an open chiplet ecosystem and ubiquitous interconnect on the bundle degree. UCIe Consortium is led by key trade leaders Superior Semiconductor Engineering, Inc. (ASE), Alibaba Group, AMD, Arm, Google Cloud, Intel Company, Meta, Microsoft Company, NVIDIA, Qualcomm Included, Samsung Electronics, and Taiwan Semiconductor Manufacturing Firm. For extra data, go to www.UCIexpress.org.

About proteanTecs

proteanTecs is a number one supplier of deep knowledge monitoring options for superior electronics within the Datacenter, Automotive, Communications and Cellular markets. Primarily based on Common Chip Telemetry™ (UCT), the corporate offers system well being and efficiency monitoring, from manufacturing to the sector. By making use of machine studying to novel knowledge created by on-chip UCT brokers, the corporate’s analytics platform delivers predictive insights and visibility, resulting in new ranges of high quality, reliability and scale. Based in 2017, the corporate is headquartered in Israel with places of work in New Jersey, California, India and Taiwan. For extra data, go to: www.proteanTecs.com.

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